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FDR8521L August 2000 FDR8521L P-Channel MOSFET With Gate Driver For Load Switch Application General Description This device is designed for configuration as a load switch and is particularly suited for power management in portable battery powered electronic equipment. Designed to operate from 3V to 20V input and supply up to 2.9A, the device features a small N-Channel MOSFET (Q1) together with a large P-Channel Power MOSFET (Q2) in a single SO-8 package. Features *V V DROP DROP = 0.07 V @ V = 12 V, I = 1 A.R(ON) = 0.07 IN L = 0.115 V @ V = 5 V, I = 1 A.R(ON) = 0.115 . IN L *V V DROP DROP = 0.2 V @ V = 12 V, I =2.9 A.R(ON) = 0.07 IN L = 0.2 V @ V = 5 V,I = 1.8 A.R(ON) = 0.115 . IN L * Control MOSFET (Q1) includes Zener protection for * ESD ruggedness (>6kV Human Body Model). High density cell design for extremely low on-resistance. Applications * Power management * Load switch VOUT,C1,CO 5 6 7 8 Q2 4 3 VIN,R1,Ci EQUIVALENT CIRCUIT R1,R2,C1 VOUT,C1,CO R2 Q1 2 1 C1,CO IN VDR OP + - OUT R2 VON/OFF pin 1 ON/OFF SuperSOT -8 TM See Application Cir cuit Absolute Maximum Ratings Symbol V IN V ON/OFF ID PD T J , T stg ESD Input Voltage Range On/Off Voltage Range Load Current - Continuous - Pulsed Maximum Power Dissipation TA=25 oC unless otherwise noted Parameter (Note 1) Ratings 3 - 20 2.5 - 8 (Note 2) Units V V A W C kV 2.9 8 0.8 -55 to +150 6 (Note 2) Operating and Storage Temperature Range Electrostatic Discharge Rating MIL-STD-883D Human-Body-Model (100pf/1500 Ohm) Thermal Characteristics R JA R JC Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case (Note 2) (Note 2) 156 40 C/W C/W Package Marking and Ordering Information Device Marking 8521L Device FDR8521L Reel Size 13'' Tape width 12mm Quantity 3000 units 2000 Fairchild Semiconductor International FDR8521L Rev. C FDR8521L Electrical Characteristics Symbol Parameter TA=25 C unless otherwise noted o Test Conditions Min Typ Max Units OFF Characteristics IFL Forward Leakage Current (Note 3) VIN = 20 V, VON/OFF = 250 A 1 A ON Characteristics VDROP Conduction Voltage R(ON) IL Q2 - Static On-Resistance Load Current VIN = 12 V, VON/OFF = 3.3 V, IL = 1 A VIN = 5 V, VON/OFF = 3.3 V, IL = 1 A VIN = 12 V, VON/OFF = 3.3 V, IL = 2.9 A VIN = 5 V, VON/OFF = 3.3 V, IL = 1.8 A VGS = -12 V, ID = 2.9 A VGS = -5 V, ID = 1.8 A VDROP = 0.2 V, VIN = 12 V, VON/OFF = 3.3 V VDROP = 0.2 V, VIN = 5 V, VON/OFF = 3.3 V 0.053 0.085 0.054 0.090 2.9 1.8 0.070 0.115 0.200 0.200 0.070 0.115 V A Notes: 1. Range of VIN can be up to 25V, but R1 and R2 must be scaled such that VGS of Q2 does not exceed -20V. 2. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RJA is determined by the user's board design. 3. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0%. FDR8521L Load Switch Application APPLICATION CIRCUIT Q2 IN R1 C1 O UT R2 Ci Co LOAD ON/OFF Q1 External Component Recommendation: For applications where Co 1F. For slew rate control, select R2 in the range of 470 - 10k . For additional in-rush current control,C1 1000pF can be added. Select R1 so that the R1/R2 ratio ranges from 10 - 100. R1 is required to turn Q2 off. FDR8521L Rev. C FDR8521L Typical Characteristics (continued) 0.7 0.6 0.5 VDROP (V) 0.4 0.3 0.2 TA = 25 C o 1 VIN = 12V VON/OFF = 1.5 - 8V PW = 300S, D < 2% TA = 125 C VDROP (V) o 0.8 VIN = 5V VON/OFF = 1.5 - 8V PW = 300S, D < 2% TA = 125 C o 0.6 TA = 25 C 0.4 o 0.2 0.1 0 0 1 2 3 4 IL (A) 5 6 7 8 0 0 1 2 3 4 IL (A) 5 6 7 8 Figure 1. Conduction Voltage Drop Variation with Load Current. Figure 2. Conduction Voltage Drop Variation with Load Current. 0.3 0.25 0.2 VDROP (V) 0.15 0.1 0.05 0 2 4 6 8 10 12 TA = 125 C o IL = 1A VON/OFF = 1.5V -8V PW = 300S, D < 2% TA = 25 C o VIN, INPUT VOLTAGE (V) Figure 3. On-Resistance Variation with Input Voltage. 1 TRANSIENT THERMAL RESISTANCE 0.5 0.2 0.1 0.05 0.02 0.01 0.005 0.002 0.001 0.0001 0.001 0.01 0.1 t1 , TIME (sec) 1 D = 0.5 0.2 0.1 0.05 0.02 0.01 Single Pulse r(t), NORMALIZED EFFECTIVE R JA (t) = r(t) * R JA R JA = 156 C/W P(pk) t1 t2 TJ - TA = P * R JA (t) Duty Cycle, D = t 1/ t 2 10 100 300 Figure 4.Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 2. Transient themal response will change depending on the circuit board design. FDR8521L Rev. C SuperSOTTM-8 Tape and Reel Data and Package Dimensions SSOT-8 Packaging Configuration: Figure 1.0 Customized Label Packaging Description: SSOT-8 parts are shipped in tape. The carrier tape is made from a di ssipat ive (carbo n filled) po ly carbon ate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film , adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped w ith 3,000 units per 13" or 330cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (antistatic coated). Other option comes in 500 unit s per 7" or 177cm diameter reel. This and some other options are further described in the Packagin g Information table. These full reels are in di vidu ally barcod e labeled and placed inside a standard intermediate box (ill ustrated in figure 1.0) made of recyclable corrugated brow n paper. One box contains two reels maximum. And t hese boxes are placed ins ide a barcode labeled shipp ing bo x whic h comes in di fferent sizes depend in g on t he nu mber of parts shippe d. F63TNR Label Anti static Cover Tape Static Dissi pat ive Emboss ed Carrier Tape F852 831N F852 831N F852 831N F852 831N F852 831N Pin 1 SSOT-8 Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Max qty per Box Weight per unit (gm) Weight per Reel (kg) Note/Comments Standard (no f l ow c ode ) D84Z TNR 500 7" Dia 184x187x47 1,000 0.0416 0.0980 TNR 3,000 13" D ia 343x64x343 6,000 0.0416 0.5615 SSOT-8 Unit Orientation 343mm x 342mm x 64mm Intermediate box for Standar d and L99Z Opti ons F63TNR Label F63TNR Label F63TNR Labe l sa mpl e 184mm x 187mm x 47mm Pizza Box fo r D84Z Option F63TNR Label LOT: CBVK741B019 FSID: FDR835N QTY: 3000 SPEC: SSOT-8 Tape Leader and Trailer Configuration: Figur e 2.0 D/C1: D9842 D/C2: QTY1: QTY2: SPEC REV: CPN: N/F: F (F63TNR)3 Carrier Tape Cover Tape Components Traile r Tape 300mm mi nimum or 38 empty pockets Lead er Tape 500mm mi nimum or 62 empty poc kets August 1999, Rev. C SuperSOTTM-8 Tape and Reel Data and Package Dimensions, continued SSOT-8 Embossed Carrier Tape Configuration: Figur e 3.0 T E1 P0 D0 F K0 Wc B0 E2 W Tc A0 P1 D1 User Direction of Feed Dimensions are in millimeter Pkg type SSOT-8 (12mm) A0 4.47 +/-0.10 B0 5.00 +/-0.10 W 12.0 +/-0.3 D0 1.55 +/-0.05 D1 1.50 +/-0.10 E1 1.75 +/-0.10 E2 10.25 mi n F 5.50 +/-0.05 P1 8.0 +/-0.1 P0 4.0 +/-0.1 K0 1.37 +/-0.10 T 0.280 +/-0.150 Wc 9.5 +/-0.025 Tc 0.06 +/-0.02 Notes : A0, B0, and K0 dimensions are deter mined with r espec t to t he EIA/Jedec RS-481 rotationa l and lateral movement requi remen ts (see sketches A, B, and C). 20 deg maximum Typical component cavity center line 0.5mm maximum B0 20 deg maximum component rotation 0.5mm maximum Sketch A (Si de or Front Sectional View) Component Rotation A0 Sketch B (Top View) Typical component center line Sketch C (Top View) Component lateral movement SSOT-8 Reel Configuration: Figur e 4.0 Component Rotation W1 Measured at Hub Dim A Max Dim A max Dim N See detail AA 7" Diameter Option B Min Dim C See detail AA W3 Dim D min 13" Diameter Option W2 max Measured at Hub DETAIL AA Dimensions are in inches and millimeters Tape Size 12mm Reel Option 7" Dia Dim A 7.00 177.8 13.00 330 Dim B 0.059 1.5 0.059 1.5 Dim C 512 +0.020/-0.008 13 +0.5/-0.2 512 +0.020/-0.008 13 +0.5/-0.2 Dim D 0.795 20.2 0.795 20.2 Dim N 5.906 150 7.00 178 Dim W1 0.488 +0.078/-0.000 12.4 +2/0 0.488 +0.078/-0.000 12.4 +2/0 Dim W2 0.724 18.4 0.724 18.4 Dim W3 (LSL-USL) 0.469 - 0.606 11.9 - 15.4 0.469 - 0.606 11.9 - 15.4 12mm 13" Dia (c) 1998 Fairchild Semiconductor Corporation July 1999, Rev. C SuperSOTTM-8 Tape and Reel Data and Package Dimensions, continued SuperSOTTM-8 (FS PKG Code 34, 35) 1:1 Scale 1:1 on letter size paper Di mensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.0416 September 1998, Rev. A TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM BottomlessTM CoolFETTM CROSSVOLTTM DOMETM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM FAST(R) DISCLAIMER FASTrTM GlobalOptoisolatorTM GTOTM HiSeCTM ISOPLANARTM MICROWIRETM OPTOLOGICTM OPTOPLANARTM POPTM PowerTrench(R) QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM UHCTM VCXTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. F1 |
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